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Introduction
About NMSL
Equipment
Contact Us
People
Professor
Members
Pos-doc
Ph.D
Ph.D - M.S.
M.S.
Alumni
Research
Research Area
Publication
International
Domestic
Patent
Community
News
Gallery
Research
Electrochemical Nano-Materials and System Lab
Research Area
Publication
International
Domestic
Patent
International Journal
Research Area
Publication
International
Domestic
Patent
International Journal
Total
8
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전체
2024
2023
2022
2021
2020
2019
2018
2017
2016
2015~
All Papers
2022
8 Papers
109
Cu Electrochemical Polishing for RDL Process of FOWLP and Effects of Cu Overburden Profiles
Park Kimoon
,
Lee Jinhyun
,
Kim Youjung
,
Yoo Bongyoung
,
Yoon Sanghwa
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
108
The self-annealing phenomenon of electrodeposited nano-twin copper with high defect density
Han
,
H
,
chaerin Lee
,
youjung Kim
,
jinhyun Lee
,
sanghwa Yoon
,
Bongyoung Yoo
Frontiers in chemistry
107
Factors infuencing the deposition of the inverse shape of 3D metal printing using electrochemical deposition
Hyng Rae Kim
,
Young‑kuk Kim
,
Bongyoung Yoo
,
Sanghwa Yoon
,
Sung‑bin Kim
,
Sanghwa Yoon
,
Sung‑bin Kim
Springer Verlag
106
Capacitive humidity sensing properties of freestanding bendable porous SiO2/Si thin films
Soobin Park
,
Jinmyeong Seo
,
Jungjoon Park
,
Inseong Hwang
,
Han-Seung Lee
,
Hyunsung Jung
,
Bongyoung Yoo
Scientific Reports
105
Synthesis of Copper Telluride Thin Films by Electrodeposition and Their Electrical and Thermoelectric Properties
Jungjoon Park
,
Jinmyeong Seo
,
Jae-Hong Lim
,
Bongyoung Yoo
Frontiers in chemistry
104
Simple synthesis of a CoO nanoparticle-decorated nitrogen-doped carbon catalyst from spent coffee grounds for alkaline hydrogen evolution
Bayaraa Sukhbaatar
,
Sanghwa Yoon
,
Bongyoung Yoo
Journal of Material Science
103
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
Kimoon Park
,
Bongyoung Yoo
,
Fumihiro Inoue
,
Jaber Derakhshandeh
Japanese journal of applied physics
102
Cu Electrochemical Polishing for RDL Process of FOWLP and Effects of Cu Overburden Profiles
Park Kimoon
,
Lee Jinhyun
,
Kim youjung
,
Yoo Bongyoung
,
Yoon Sanghwa
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
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