Research

Electrochemical Nano-Materials and System Lab

International Journal

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FRONTIERS IN CHEMISTRY 2020

Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)

Youjung Kim, Sanghyun Jin, Kimoon Park, Jinhyun Lee, Bongyoung Yoo, Jae-Hong Lim
관리자 · 조회 461 · 2022-03-03
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이전글 Detection of corrosion of post-tensioned tendons using replaceable reference electrodes plugged into surface-mounted sockets