Research

Electrochemical Nano-Materials and System Lab

International Journal

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Journal of Nanoscience and Nanotechnology 2019

Electrochemical Polishing of Cu Redistribution Layers for Fan-Out Wafer Level Packaging

Kimoon Park, Jinhyun Lee, Bongyoung Yoo
관리자 · 조회 290 · 2022-03-03
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이전글 Improved Chloride Ion Sensing Performance of Flexible Ag-NPs/AgCl Electrode Sensor Using Cu-BTC as an Effective Adsorption Layer