Electroless Ru/Cu Deposition Without Pd Activation for the Formation of Continuour Cu Seend Layers in High-Aspect Ratio Via-Holes > International Journal | 한양대 나노소재 및 시스템 연구실(nmsl)

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Electrochemical Nano-Materials and System Lab

International Journal

Journal of Nanoscience and Nanotechnology 2016 submitted

Electroless Ru/Cu Deposition Without Pd Activation for the Formation of Continuour Cu Seend Layers in High-Aspect Ratio Via-Holes

Sungho Seo,Bongyoung Yoo

관리자 · 조회 262 · 2017-12-20

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이전글 The Effects of Bath Temperature on the Formation of Nanotwin in Electrodeposited Cu 다음글 Effect of the Laser-Scribing on Spalling of a Single Crystalline Si Using Electrodeposition Assisted Stripping (EAS) Process