Electrodeposition of Nanotwin Cu by Pulse Current for Through-Si-Via (TSV) Process > International Journal | 한양대 나노소재 및 시스템 연구실(nmsl)

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Electrochemical Nano-Materials and System Lab

International Journal

Journal of Nanoscience and Nanotechnology 2016 submitted

Electrodeposition of Nanotwin Cu by Pulse Current for Through-Si-Via (TSV) Process

Sanghyun Jin,Geon Wang,Sungho Seo,Bongyoung Yoo

관리자 · 조회 314 · 2017-12-20

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이전글 Microfabrication for Drug Delivery 다음글 Through-silicon-via (TSV) filling by electrodeposition with pulse-reverse current