Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu > International Journal | 한양대 나노소재 및 시스템 연구실(nmsl)

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Electrochemical Nano-Materials and System Lab

International Journal

Applied Surface Science 2021

Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu

Haneul Han, Chaerin Lee, Youjung Kim, Jinhyun Lee, Rosa Kim, Jongryoul Kim, Bongyoung Yoo

관리자 · 조회 502 · 2022-03-03

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이전글 Metal-free high-adsorption-capacity adsorbent derived from spent coffee grounds for methylene blue 다음글 Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)