Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV) > International Journal | 한양대 나노소재 및 시스템 연구실(nmsl)

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Electrochemical Nano-Materials and System Lab

International Journal

FRONTIERS IN CHEMISTRY 2020

Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)

Youjung Kim, Sanghyun Jin, Kimoon Park, Jinhyun Lee, Bongyoung Yoo, Jae-Hong Lim

관리자 · 조회 457 · 2022-03-03

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이전글 Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu 다음글 Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing