Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing > International Journal | 한양대 나노소재 및 시스템 연구실(nmsl)

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Electrochemical Nano-Materials and System Lab

International Journal

Journal of Alloys and Compounds 2020

Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing

Chaerin Lee, Youjung Kim, Rosa Kim, Bongyoung Yoo, Jin-Kyung Kim, Bongyoung Yoo

관리자 · 조회 381 · 2022-03-03

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이전글 Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV) 다음글 The characteristics of selective 3D metal addivive process using electrochemical deposition and nozzle fluid dynamics