SELECTIVE Cu ELECTRODEPOSITION ON MICROMETER TRENCHES USING MICROCONTACT PRINTING AND ADDITIVES > International Journal | 한양대 나노소재 및 시스템 연구실(nmsl)

Research

Electrochemical Nano-Materials and System Lab

International Journal

ARCHIVES OF METALLURGY AND MATERIALS 2021

SELECTIVE Cu ELECTRODEPOSITION ON MICROMETER TRENCHES USING MICROCONTACT PRINTING AND ADDITIVES

Jinyoung Shim, Jinhyun Lee, Bongyoung Yoo

관리자 · 조회 277 · 2022-03-03

목록

이전글 Study of Cu Electrochemical Polishing Mechanism With Observation of Water Acceptor Diffusion 다음글 Detection of corrosion of post-tensioned tendons using replaceable reference electrodes plugged into surface-mounted sockets