Cu Electrochemical Polishing for RDL Process of FOWLP and Effects of Cu Overburden Profiles > International Journal | 한양대 나노소재 및 시스템 연구실(nmsl)

Research

Electrochemical Nano-Materials and System Lab

International Journal

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 2022

Cu Electrochemical Polishing for RDL Process of FOWLP and Effects of Cu Overburden Profiles

Park Kimoon, Lee Jinhyun, Kim youjung, Yoo Bongyoung, Yoon Sanghwa

관리자 · 조회 435 · 2024-03-28

목록

이전글 Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding 다음글 Study on Roasting for Selective Lithium Leaching of Cathode Active Materials from Spent Lithium-Ion Batteries